For over 35 years, Lenox Laser has specialized in precision laser drilling of small holes, slits, and shapes in a wide variety of substrates. Flow control orifices are available in standard Swagelok® fittings, as well as custom applications – with holes ranging from the thousands of microns, down to 0.5 micron. These orifices can be calibrated to NIST(National Institute of Standards and Technology) traceable standards, and are designed to perform at a specified flow rate. In 2009, we unveiled several new lasers, expanding our precision drilling and marking capabilities. Our enhanced laser marking facilities incorporate ultra-fast, ultra-precise lasers and software. Laser marking is possible in a wide range of materials and thicknesses and are available for custom applications. We have processed silicon, titanium, stainless steel, nickel, polycarbonates, and other materials. In addition to our laser drilling of microholes, Lenox Laser also laser processes custom projects. The personal goal and commitment of each member of the Lenox Laser Corporation’s engineering team is to provide our customers with reliable and robust products made to specified custom requirements and conditions, such as, high energy light beam densities, aggressive chemical and biological environments, mechanical stresses and vibrations, aerospace and underwater uses, etc. We have a wide range of tools at our disposal. Our lasers range from CW(continuous wave) to picoseconds in pulse widths, from far IR(infrared) to hard UV(ultraviolet) wavelengths, from Joules to micro-Joules in laser beam energy. We can drill to a specified gas or liquid flow or to a specific light intensity depending on the application and specifications of the project.